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LUPA, Renesas accelearte automotive smart camera development

LUPA Electronics GmbH and Renesas Electronics Corporation have announced the EagleCAM module, an open front camera solution. While the former is an automotive safety solution...

Automotive SoC Functional Safety Technologies from Renesas

Renesas Electronics Corporation has announced the development of processor technologies for automotive systems-on-chip (SoCs). These are to be used in applications like advanced driver assistance...

Renesas updates R-Car V3H with improved deep learning performance

Renesas Electronics Corporation has unveiled an update of its R-Car V3H system-on-chip (SoC). This update from the supplier of advanced semiconductor solutions will to deliver...

Renesas ties up with Microsoft to accelerate development of connected vehicles

Renesas Electronics Corporation has announced its collaboration with Microsoft to accelerate the development of connected vehicles. The premier supplier of advanced semiconductor solutions has unveiled...

Renesas, FAW set up joint lab for next-gen smart vehicles

Renesas Electronics Corporation and China FAW Group Corporation (FAW) have announced the establishment of a joint laboratory in Changchun, China, effective December 1, 2020. While...

Ceva’s DSP solution to power Renesas’ next-gen automotive SoC

Ceva, Inc. has announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC). DSP-based solutions of Ceva, a...

Renesas R-Car Consortium selects StradVision as member for its ADAS capabilities

Renesas' R-Car Consortium Proactive Partner Program has selected StradVision as its member for the second consecutive year. StradVision's Artificial Intelligence-based camera perception software is a...

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